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TVS Diode Arrays (SPA ? Diodes)
General Purpose ESD Protection - SP720 Series
Package Dimensions — Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
E
H
0.25(0.010) M
B M
Package
Pins
SOIC
16
-B-
JEDEC
MS-012
1
2
3
L
Millimeters
Min Max
Inches
Min
Max
Notes
SEATING PLANE
A
1.35
1.75
0.0532
0.0688
-
-A-
D
A
h x 45 o
A1
B
0.10
0.33
0.25
0.51
0.0040
0.013
0.0098
0.020
-
9
-C-
C
0.19
0.25
0.0075
0.0098
-
Notes:
e
B
0.25(0.010) M C A M B S
A1
μ
0.10(0.004)
C
D
E
e
H
h
9.80 10.00
3.80 4.00
1.27 BSC
5.80 6.20
0.25
0.50
0.3859 0.3937
0.1497 0.1574
0.050 BSC
0.2284 0.2440
0.0099
0.0196
3
4
-
-
5
NOTES:
1. Symbolsare de?nedin the “MOSeries SymbolList”in Section 2.2 of
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication
Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash,
and gate burrs shall
protrusion PublicationNumber95. not exceed 0.15mm (0.006 inch) per side.
L
N
μ
0.40
0o
16
1.27
8o
0.016
0o
16
0.050
8o
6
7
-
2. “E” not include interlead flash or protrusions.
3. shall not exceed not 0.25mm (0.010 inch) per side.
4. Dimension Dimensioningand tolerancingper ANSI Y14.5M-1982. Interlead flash and
protrusions Dimension“D”does includemold?ash, protrusionsor gate burrs.
Mold on the body optional. If is not shall not a visual index (0.006
5. The chamfer ?ash, protrusionand gate it burrs present, exceed 0.15mm feature must be
inch) side.
located within per the crosshatched area.
is the length of ”does for soldering substrate.
6. “L” 4. Dimension “E terminal notincludeinterlead?ashor protrusions.Interlead
7.
the and of terminal shall
“N” is ?ash number protrusions positions. exceed 0.25mm (0.010 inch) per side.
feature must be located withinthe crosshatchedarea.
5. numbers the for is reference only.
8. Terminal The chamfer on shown body optional.If it is not present, a visual index
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating
6. “L” is not exceed a maximum value of 0.61mm (0.024 inch).
plane, shall the lengthof terminalfor solderingto a substrate.
7. “N the numberof Converted
10. Controlling ”is dimension:MILLIMETER. terminalpositions. inch dimensions are not necessarily
8.
exact. Terminal numbersare shownfor reference only.
9. The lead width“B”,as measured0.36mm(0.014 inch) or greaterabove
the seating plane, shall not exceed a maximumvalue of 0.61mm
(0.024 inch).
Part Numbering System
10. Controllingdimension:MILLIMETER. Convertedinch dimensionsare
Product Characteristics
SP720 ** **
not necessarilyexact.
Lead Plating
Matte Tin
TVS Diode Arrays
(SPA ? Diodes)
Series
P=Lead Free
G=Green
TG= Tape and Reel / Green
Package
AB = 16 Ld SOIC
AP = 16 Ld PDIP
Lead Material
Lead Coplanarity
Substitute Material
Copper Alloy
0.004 inches (0.102mm)
Silicon
See Ordering Information section for specific options available
Ordering Information
Body Material
Flammability
Molded Epoxy
UL 94 V-0
Part Number
SP720APP
SP720ABG
SP720ABTG
Temp. Range (oC)
-40 to 105
-40 to 105
-40 to 105
Package
16 Ld PDIP
16 Ld SOIC
16 Ld SOIC
Tape and Reel
Environmental
Informaton
Lead-free
Green
Green
Marking
SP720AP(P) 1
SP720A(B)G 2
SP720A(B)G 2
Min. Order
1500
1920
2500
Notes:
1. SP720AP(P) means device marking either SP720AP or SP720APP.
2. SP720A(B)G means device marking either SP720AG or SP720ABG which are good for types SP720ABG and SP720ABTG.
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
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